Patent · US Expired

Semiconductor integrated circuit device and manufacturing method thereof

US5073810A · kind A · utility

17Cited by
1References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 19, 1990
Grant dateDec 17, 1991
Priority date
Expiry dateOct 19, 2010

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D88/00

Abstract

A semiconductor integrated circuit device having at least one bipolar transistor comprises a semiconductor substrate of monocrystalline silicon having a main surface; an isolation oxide layer selectively formed on the main surface so as to surround an active region of the main surface; a first silicon layer formed on the active region and extending on the isolation oxide layer and a second silicon layer stacked on the first silicon layer, wherein a collector region of a bipolar transistor is formed on the active region of the first silicon layer, the intrinsic base region is formed on the active region of the second silicon layer, and a base-lead out region which is electrically connected with the intrinsic base region is formed of the first and second silicon layers over the isolation oxide layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.