Non-aqueous electrolytic aluminum plating bath composition
US5074973A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jun 18, 1990 |
| Grant date | Dec 24, 1991 |
| Priority date | — |
| Expiry date | Jun 18, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is disclosed a non-aqueous electrolytic aluminum plating bath composition comprising an aluminum halide and a nitrogen-containing heterocyclic onium halide compound and containing an additive selected from the group consisting of an inorganic halide compound, aromatic aldehyde, ketone or carboxylic acid, an unsaturated heterocyclic compound containing more than one nitrogen atom, an unsaturated heterocyclic compound containing a sulfur atom, an aromatic hydrocarbon compound containing a sulfur atom, an aromatic hydrocarbon compound containing an amino group and an aromatic amine; and further optionally an organic polymer. The bath composition is easy in maintenance, has good covering power, and enables smooth plating with low current density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.