Bonding electrical leads to pads with particles
US5076485A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 20, 1990 |
| Grant date | Dec 31, 1991 |
| Priority date | — |
| Expiry date | Dec 20, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1089
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Bonding a plurality of TAB tape leads to electrical pads in and aligned with the surface of a die by covering the pads with a plurality of electrically conductive particles, aligning the electrical leads with the particles and the pads, and simultaneously bonding the particles to the pads and the electrical leads to the particles so that each bonded particle is between and in contact with a pad and a lead. Preferably the particles are solid spheres 1.0 mils in diameter. The spheres may be applied by covering the entire surface with the spheres, covering the pads with an adhesive material prior to the spheres, or covering the pads with a mixture of vehicle and spheres.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.