Apparatus for cooling compact arrays of electronic circuitry
US5079619A · kind A · utility
35Cited by
5References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 13, 1990 |
| Grant date | Jan 7, 1992 |
| Priority date | — |
| Expiry date | Jul 13, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an arrangement for packaging planar arrays of circuit components including a plurality of essentially parallel layers in which the layers lie closely adjacent one another, one or more of the layers including a substrate of insulating material having circuit board apparatus imbedded therein, the improvement including apparatus positioned against at least one of the layers for removing heat from the arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.