Connecting structure of electronic part and electronic device using the structure
US5086337A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1988 |
| Grant date | Feb 4, 1992 |
| Priority date | — |
| Expiry date | Sep 13, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention relates to a connecting structure for electrically connecting an electronic part such as an LSI chip to a substrate, its production method and an electronic device using the former. The present invention is particularly useful for connecting electrically a plurality of chips, for which an absorption function of the difference of thermal expansion in a horizontal direction and capability of displacement in a vertical direction are requisite, to a substrate. Moreover, the connecting structure of the present invention can simplify the fabrication process, has high reliability and can be applied to high performance electronic appliances and apparatuses such as electronic computers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.