Solder interconnection structure and process for making
US5089440A · kind A · utility
56Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 1990 |
| Grant date | Feb 18, 1992 |
| Priority date | — |
| Expiry date | Dec 10, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31547
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.