Process for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositions
US5091289A · kind A · utility
40Cited by
13References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1990 |
| Grant date | Feb 25, 1992 |
| Priority date | — |
| Expiry date | Apr 30, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a process for producing multi-level conductor/insulator films on a processed semiconductor substrate having a conductor pattern. The insulator layers, each comprise a photosensitive polyimide polymer composition, and this allows the desired wiring channels and stud vias to be formed directly in the insulator layers, without the use of separate masking layers and resulting image transfer steps, thus providing a less cumbersome and costly process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.