Method of gluing substrates using a composition comprising an arylaliphatic copolyimide with ether chain formations and an epoxy resin
US5093202A · kind A · utility
4Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 1990 |
| Grant date | Mar 3, 1992 |
| Priority date | — |
| Expiry date | Aug 2, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Adhesive compositions are described comprising at least an arylaliphatic olyimide with ether chain formations, obtained by the polycondensation reaction of a tetracarboxylic aromatic acid or of one of its derivatives with at least two primary diamines, one of these diamines consisting of a polyether chain ending with the two amine functional groups and at least an epoxy resin possessing more than one epoxy group per molecular. These adhesive compositions can be used particularly for the gluing of films of polymers to thin metal sheets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.