Method of producing semiconductor memory packages
US5095626A · kind A · utility
43Cited by
7References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 1989 |
| Grant date | Mar 17, 1992 |
| Priority date | — |
| Expiry date | Aug 10, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In surface packaging of thin resin packages such as resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices wherein the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.