Process for producing copper-clad laminate
US5096522A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jun 22, 1990 |
| Grant date | Mar 17, 1992 |
| Priority date | — |
| Expiry date | Jun 22, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0726
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for producing a copper-clad laminate is disclosed which includes the steps of (a) contacting the surface of a conductive carrier with a catalyst liquid containing at least one noble metal selected from the group consisting of Pd, Pt, Ru, Au, and Ag; (b) subsequently forming a copper foil layer on the treated surface of the conductive carrier by copper electroplating; (c) laminating an insulating base on the copper foil layer by hot-press bonding; and (d) separating the conductive carrier from the resulting laminate. The copper foil layer in the resulting copper-clad laminate has reduced pinholes and exhibits isotropic mechanical characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.