Method of forming a conductive contact bump on a flexible substrate and a flexible substrate
US5097101A · kind A · utility
99Cited by
8References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 5, 1991 |
| Grant date | Mar 17, 1992 |
| Priority date | — |
| Expiry date | Feb 5, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit board is formed from a sheet of polyimide having a contact pad on its first side and a continuous layer of copper on its second side by removing copper from the second side so as to leave at least one discrete island that confronts the pad through the sheet of insulating material, and applying force to the island in the direction from the second side toward the first side, whereby the island is deformed plastically to form a dimple and the pad is deformed plastically to form a bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.