Semiconductor package and computer using it
US5097318A · kind A · utility
38Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1989 |
| Grant date | Mar 17, 1992 |
| Priority date | — |
| Expiry date | Apr 3, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cavity-down type package for a semiconductor device comprises an insulating base substrate on which the semiconductor device and another insulating cap substrate with plural outer connection terminals on its outer surface and with electrodes provided on conductive layers for electric conduction on its inner surface. The electrodes on the insulating base substrate and those on the insulating cap substrate are connected with each other by using conductive material such as bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.