Masahide Okamoto
22Patents
8h-index
51Co-inventors
78Inventor score
Filing activity: Apr 3, 1989 → Sep 8, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6563225B2 | Product using Zn-Al alloy solder | Electricity | 78 | Expired |
| US5097318A | Semiconductor package and computer using it | Electricity | 38 | Expired |
| US5277723A | Method for producing multilayer ceramic body with convex side faces | Electricity | 26 | Expired |
| US7256501B2 | Semiconductor device and manufacturing method of the same | Electricity | 22 | Expired |
| US6555052B2 | Electron device and semiconductor device | Emerging Cross-Sectional Technologies | 18 | Expired |
| US5731066A | Electronic circuit device | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6774490B2 | Electronic device | Emerging Cross-Sectional Technologies | 9 | Expired |
| US5825632A | Circuit substrate and electronics computer, using sintered glass ceramics | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6118671A | Circuit substrate and manufacture thereof, ceramic composition for circuit substrate, and electronics computer | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7722962B2 | Solder foil, semiconductor device and electronic device | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7579677B2 | Semiconductor device and method for manufacturing thereof | Electricity | 6 | Active |
| US6585149B2 | Packaging method using lead-free solder | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7274103B2 | Semiconductor device and manufacturing method thereof | Electricity | 3 | Expired |
| US6248960A | Ceramics substrate with electronic circuit and its manufacturing method | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7048173B2 | Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly | Electricity | 2 | Expired |
| US6384347B1 | Glass-ceramic wiring board | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6658733B2 | Method of manufacturing via interconnection of glass-ceramic wiring board | Emerging Cross-Sectional Technologies | 1 | Expired |
| US8525330B2 | Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer | Emerging Cross-Sectional Technologies | 0 | Active |
| US8356742B2 | Method for manufacturing a semiconductor device using an Al-Zn connecting material | Emerging Cross-Sectional Technologies | 0 | Active |
| US7131566B2 | Packaging method using lead-free solder | Emerging Cross-Sectional Technologies | 0 | Expired |
| US8389854B2 | Metal strip, connector, and method of manufacturing metal strip | Emerging Cross-Sectional Technologies | 0 | Active |
| US9393645B2 | Junction material, manufacturing method thereof, and manufacturing method of junction structure | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.