Semiconductor device and method for manufacturing the same
US5101263A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 1990 |
| Grant date | Mar 31, 1992 |
| Priority date | — |
| Expiry date | Jun 21, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a plastic encapsulated semiconductor device, a part of wire piece may break down due to thermal fatigue, which positioned adjacent to a bonding portion of the wire piece connected to a chip. This is caused by that wire piece moves relative to plastic encapsulating the chip and the wire piece, and a strain in the wire piece due to thermal deformation of the device concentrates on one portion of the wire piece. Accordingly, a rugged portion is formed on a surface of a part of wire piece subjected to a breakdown to thermal fatigue. The plastic bites recesses of the rugged portion to prevent the wire piece from moving relative to the plastic, thereby preventing the wire piece from breaking down due to thermal fatigue.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.