Process for surface treatment by plasma of a substrate supported by an electrode
US5102687A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Nov 22, 1989 |
| Grant date | Apr 7, 1992 |
| Priority date | — |
| Expiry date | Nov 22, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F4/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to a process for surface treatment of a substrate carried by an electrode and immersed in a sealed engraving or deposition chamber equipped with plasma generating means, of the type involving the application to the electrodes, of a variable voltage, produced by a generator that is independent of the plasma generating means, wherein said process comprises the steps of: PA1 maintaining within said chamber a continuous plasma that is free of electromagnetic fields; PA1 supplying said electrode via a low impedance capacitor using a signal comprised of rectangular voltage pulses having: PA2 a variable pulse repetition rate to control the energy distribution function of the positive ionic charges bombarding the substrate, PA2 a variable mark-to-space ratio for each pulse to control the time distribution of the negative electron charges and the positive ionic charges bombarding the substrate, and PA2 a variable pulse amplitude to control the energy of the positive ionic charges bombarding the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.