Patent · US Expired

Positive photoresist composition containing radiation sensitive quinonediazide compound and completely esterified polyamic acid polymer

US5104768A · kind A · utility

11Cited by

7References

2Claims

0Family size

Assignee

Ciba-Geigy · US

Inventors

Jörg Sassmannshausen · Darmstadt, DE
Reinhard Schulz · Hannover, DE
Ekkehard Bartmann · Langen (Hessen), DE

Key dates

Filing date	Nov 2, 1989
Grant date	Apr 14, 1992
Priority date	—
Expiry date	Nov 2, 2009

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S430/107
WIPO fieldOptics
WIPO sectorInstruments

Abstract

The invention relates to positive working photoresists for producing relief structures of high-temperature resistant polyimide prepolymers, which photoresists can be developed in aqueous-alkaline medium and which contain, in an organic solvent, essentially at least PA0 a) one prepolymer which is convertible into a polyimide, PA0 b) one radiation-sensitive quinonediazide compound, and further optional components, said prepolymer being a completely esterified polyamic acid polymer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.