Patent · US Expired

Preparing highly thermoresistant relief structures

US5104773A · kind A · utility

2Cited by

8References

21Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Hellmut Ahne · Königsee, DE
Albert Hammerschmidt · Erlangen, DE
Erwin Schmidt · Baltmannsweiler, DE

Key dates

Filing date	Mar 29, 1990
Grant date	Apr 14, 1992
Priority date	—
Expiry date	Mar 29, 2010

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S430/146
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Highly thermoresistant relief structures can be produced simply and cost-effectively from polybenzoxazole precursors which do not have any polymerizable groups, respectively without any photoactive components being present, when soluble hydroxypolyamides are applied in the form of a layer or film on a substrate and are irradiated through a mask by means of an UV-excimer laser with a power density >10.sup.5 W/cm.sup.2 per pulse, and are developed with an aqueous-alkaline developing agent and subsequently tempered.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.