Polyimide precursor composition and application therefrom
US5104968A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 1990 |
| Grant date | Apr 14, 1992 |
| Priority date | — |
| Expiry date | Aug 8, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Polyimide precursor compositions incorporating at least one compound of fula (1), at least one compound of formula (2), at least one compound of formula (3) and at least one compound of formula (4) ##STR1## in which one of the groups R.sup.3 and R.sup.4 represents a hydrogen atom and the other, in the same way as the groups R.sup.1 and R.sup.2, which can be the same or different, in each case represent a hydrocarbon group having 1 to 16 carbon atoms, m is a number between 5 and 20, n is an integer between 1 and 5 and R.sup.5 represents a hydrogen atom, a halogen atom, a hydrocarbon group with 1 to 16 carbon atoms, or a group of formula R.sup.6 --O-- in which R.sup.6 represents a hydrocarbon group having 1 to 16 carbon atoms. The preferred composition contains 30 to 70% by weight of dry matter of compounds of formulas (1), (2) and (3), in which the groups R.sup.1, R.sup.2 and one of the groups R.sup.3 and R.sup.4 is a methyl or ethyl group and the compound of formula (4) is benzyl alcohol. These compositions are usable as smoothing and/or protective coatings for metals, metal alloys or other substrates and in particular in the electrical and electronic industries, e.g. for the forma…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.