Process for metallizing a through-hole board
US5106473A · kind A · utility
17Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 1991 |
| Grant date | Apr 21, 1992 |
| Priority date | — |
| Expiry date | May 3, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process is provided for metallizing the hole-wall surface of a through-hole provided in a printed circuit board precursor. In an initial step, the hole-wall surface is pre-treated with an oxidizing agent which micro-roughens it. An electro-conductive polymer film is then formed on the micro-roughened surface by oxidatively polymerizing in situ an acidic solution of an organic monomer with an oxidizing agent previously adsorbed on the board. The polymer film includes dopant anions which are acquired from the monomer solution. Finally, a metal layer is electroplated on the electro-conductive polymer film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.