Anode structures for magnetron sputtering apparatus
US5106474A · kind A · utility
24Cited by
11References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1990 |
| Grant date | Apr 21, 1992 |
| Priority date | — |
| Expiry date | Nov 21, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/332
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An in-line sputtering system with rotating cylindrical magnetrons is fitted with a system of anodes having a large surface area. The surface area is equal to or greater than the surface area of the sputtering chambers' internal walls. The anodes may be grounded, allowed to float electrically, or connected to a separate bias power supply. The anode surfaces are protected from contamination by sputtered material or are designed so the electron collecting surface may be replaced during the sputtering process. The anodes may be equipped with a magnet array for improving electron collecting efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.