Method for the rapid deposition with low vapor pressure reactants by chemical vapor deposition
US5108983A · kind A · utility
21Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1989 |
| Grant date | Apr 28, 1992 |
| Priority date | — |
| Expiry date | Nov 21, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/737
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for applying coatings to substrates using chemical vapor deposition with low vapor pressure reagents is disclosed which comprises the steps of: (a) placing a substrate in a furnace means; (b) directly introducing powder reagents by a powder feeder means into said furnace means; and (c) vaporizing and reacting said reagents within said furnace means resulting in the deposition from the vapor phase of a coating on said substrate, wherein said coating can be an oxide superconductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.