Reduced pressure surface treatment apparatus
US5110438A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 1990 |
| Grant date | May 5, 1992 |
| Priority date | — |
| Expiry date | Jul 10, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3348
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The reduced pressure surface treatment apparatus according the present invention comprises at least one vacuum chamber and an exhaust unit and a gas supply unit connected thereto, and it is characterized in that it is provided with a holder to hold the specimen, means to bombard the specimen with ions without depositing a thin film on said specimen surface, and means to control kinetic energy of said ions to a small value. The reduced pressure surface treatment method of this invention is characterized in that substances adsorbed on the wafer surface or natural oxide film layers are removed by impinging ions on the wafer surface under a vacuum condition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.