Thermal-resistant resin composition for printed circuit boards based on triazine modified epoxy resin blends
US5112926A · kind A · utility
4Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 1991 |
| Grant date | May 12, 1992 |
| Priority date | — |
| Expiry date | Apr 8, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/034
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention provides a epoxy resin composition for structual substrate of PCB comprising a triazine-modified bisphenol A epoxy resin reacted with a multi-functional epoxy resin, a brominated epoxy resin, a curing agent and a curing promoter to form a cured product with excellent thermal resistance (Tg is about 170.degree.-220.degree. C. and mostly higher than 180.degree. C.) as well as good drilling properties and good toughness. Besides, it has comparable electrical and physical properties as the commercially available FR-4 printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.