Semiconductor device mounted upon an insulating adhesive with silicon dioxide and nickel chromium steel filling particles
US5113241A · kind A · utility
11Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1990 |
| Grant date | May 12, 1992 |
| Priority date | — |
| Expiry date | Dec 14, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprises a plurality of pellets fixed on a bed by a conductive adhesive agent, an insulating substrate having a junction wiring fixed on the bed between the semiconductor pellets, and wires for connecting the pellets and insulating substrate. The insulating substrate is fixed on the bed by an insulating adhesive agent including filling material such as particles of silicon dioxide and metal particles. The surfaces of the filling material particles are coated with an oxide film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.