Method of making multilayer circuit boards having conformal Insulating layers
US5114518A · kind A · utility
7Cited by
10References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 1990 |
| Grant date | May 19, 1992 |
| Priority date | — |
| Expiry date | Jan 10, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1028
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer circuit board having a conformal layer of an insulating material separating a circuit core from an adjacent insulating layer is disclosed. The conformal layer encapsulates the substrate and conductive pattern of circuit lines in the circuit core, thereby reducing failures caused by impurities trapped during lamination. The multilayer circuit board is manufactured by coating at least one circuit core with the conformal layer of insulating material before final lamination of the circuit cores into a multilayer circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.