Photosensitive polyimide compositions
US5114826A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 1989 |
| Grant date | May 19, 1992 |
| Priority date | — |
| Expiry date | Dec 28, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/11334
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
New photosensitive polyimide compositions and processes of using the same in the fabrication of electronic components are provided. These compositions are comprised of ##STR1## containing polyamic acids and/or the corresponding hydroxy-polyamic esters, or hydroxypolyimides and a photoactive component as an additive or as covalently bonded functionality on the polymer chain. These compositions provide positive or negative patterning options and may be used as conventional resist materials, as imageable dielectric or passivating layers, as high Tg ion implant masks or as imageable lift-off layers in the fabrication of multilevel metal structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.