Krishna G. Sachdev
75Patents
23h-index
109Co-inventors
91Inventor score
Filing activity: Oct 1, 1979 → Jul 31, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6528145B1 | Polymer and ceramic composite electronic substrates | Emerging Cross-Sectional Technologies | 118 | Expired |
| US5231751A | Process for thin film interconnect | Emerging Cross-Sectional Technologies | 111 | Expired |
| US4692205A | Silicon-containing polyimides as oxygen etch stop and dual dielectric coatings | Emerging Cross-Sectional Technologies | 109 | Expired |
| US5470693A | Method of forming patterned polyimide films | Electricity | 105 | Expired |
| US6525009B2 | Polycarboxylates-based aqueous compositions for cleaning of screening apparatus | Electricity | 74 | Expired |
| US5532608A | Ceramic probe card and method for reducing leakage current | Physics | 67 | Expired |
| US5114826A | Photosensitive polyimide compositions | Electricity | 60 | Expired |
| US4599243A | Use of plasma polymerized organosilicon films in fabrication of lift-off masks | Emerging Cross-Sectional Technologies | 58 | Expired |
| US4549824A | Ink additives for efficient thermal ink transfer printing processes | Emerging Cross-Sectional Technologies | 55 | Expired |
| US5976710A | Low TCE polyimides as improved insulator in multilayer interconnect structures | Emerging Cross-Sectional Technologies | 54 | Expired |
| US4772346A | Method of bonding inorganic particulate material | Chemistry; Metallurgy | 51 | Expired |
| US4562091A | Use of plasma polymerized orgaosilicon films in fabrication of lift-off masks | Physics | 49 | Expired |
| US6262390A | Repair process for aluminum nitride substrates | Chemistry; Metallurgy | 48 | Expired |
| US4519872A | Use of depolymerizable polymers in the fabrication of lift-off structure for multilevel metal processes | Emerging Cross-Sectional Technologies | 47 | Expired |
| US4493855A | Use of plasma polymerized organosilicon films in fabrication of lift-off masks | Physics | 42 | Expired |
| US6682872B2 | UV-curable compositions and method of use thereof in microelectronics | Emerging Cross-Sectional Technologies | 35 | Expired |
| US5422223A | Silicon-containing positive resist and use in multilayer metal structures | Physics | 33 | Expired |
| US5888308A | Process for removing residue from screening masks with alkaline solution | Electricity | 29 | Expired |
| US5591789A | Polyester dispersants for high thermal conductivity paste | Chemistry; Metallurgy | 26 | Expired |
| US5773561A | Polymer sealants/adhesives and use thereof in electronic package assembly | Emerging Cross-Sectional Technologies | 25 | Expired |
| US4525722A | Chemical heat amplification in thermal transfer printing | Emerging Cross-Sectional Technologies | 24 | Expired |
| US6569252B1 | Semi-aqueous solvent cleaning of paste processing residue from substrates | Emerging Cross-Sectional Technologies | 24 | Expired |
| US6228511A | Structure and process for thin film interconnect | Emerging Cross-Sectional Technologies | 23 | Expired |
| US5938856A | Process of removing flux residue from microelectronic components | Electricity | 23 | Expired |
| US5374503A | Method of forming patterned polyimide films | Electricity | 22 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.