Method of producing micromechanical sensors for the AFM/STM profilometry

US5116462A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Johann W. Bartha · Aidlingen, DE
• Thomas Bayer · Igersheim, DE
• Johann Greschner · Neckartenzlingen, DE
• Georg Kraus · Konz, DE
• Helga Weiss · Eppelheim, DE
• Olaf Wolter · Aidlingen, DE

Key dates

• Filing date: Aug 16, 1990
• Grant date: May 26, 1992
• Expiry date: Aug 16, 2010

Classification

• Technology area (CPC G): Physics
• CPC primary: G01Q70/16
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical sensor is described for the AFM/STM profilometry, incorporating a cantilever beam with at least one tip at its end and a mounting block at the opposite end. A method is described incorporating the steps of coating a wafer substrate with an insulating layer, forming a mask in the insulating layer, etching a trench in the wafer substrate, removing the insulating layer, coating the desired cantilever beam and tip material, respectively, etching the cantilever beam and tip material, and removing at least a portion of the supporting wafer material from the bottom side. The invention overcomes the problem of forming a micromechanical sensor having a cantilever beam, a tip with a predetermined shape and a mounting block.