Detecting completion of electroless via fill
US5116463A · kind A · utility
103Cited by
5References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1991 |
| Grant date | May 26, 1992 |
| Priority date | — |
| Expiry date | Jun 19, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for detecting the completion of electrolessly depositing metal into a via. The method includes providing a non-autocatalytic detection mask with an opening over a via containing an autocatalytic material, electrolessly depositing a conductive metal into the via which fails to plate to the mask, and continuing the deposition until metal in the via contacts the mask, at which time the electrochemical potential of the mask changes and the metal plates to and covers the entire mask. The completion of the electroless via fill can be detected by changes in both the appearance and electrochemical potential of the mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.