Lead frame plating apparatus for thermocompression bonding
US5120418A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 1991 |
| Grant date | Jun 9, 1992 |
| Priority date | — |
| Expiry date | Mar 4, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separatre independently powered anodes, is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.