Controlled adhesion conductor
US5121298A · kind A · utility
34Cited by
15References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1990 |
| Grant date | Jun 9, 1992 |
| Priority date | — |
| Expiry date | Jul 13, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/22
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Compositions useful for printing controllable adhesion conductive patterns on a printed circuit board include finely divided copper powder, a screening agent and a binder. The binder is designed to provide controllable adhesion of the copper layer formed after sintering to the substrate so that the layer can lift off the substrate in response to thermal stress. Additionally, the binder serves to promote good cohesion between the copper particles to provide good mechanical strength to the copper layer so that it can tolerate lift off without fracture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.