John A. Hearn
9Patents
7h-index
14Co-inventors
52Inventor score
Filing activity: Jan 17, 1989 → Aug 11, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5263880A | Wirebond pin-plastic header combination and methods of making and using the same | Emerging Cross-Sectional Technologies | 46 | Expired |
| US5233871A | Hybrid accelerometer assembly | Physics | 41 | Expired |
| US5121298A | Controlled adhesion conductor | Electricity | 34 | Expired |
| US5176853A | Controlled adhesion conductor | Electricity | 19 | Expired |
| US5492263A | Method for wire bonding an aluminum wire to a lead of an electronics package | Emerging Cross-Sectional Technologies | 15 | Expired |
| US5122929A | Method of achieving selective inhibition and control of adhesion in thick-film conductors | Electricity | 10 | Expired |
| US4959751A | Ceramic hybrid integrated circuit having surface mount device solder stress reduction | Electricity | 9 | Expired |
| US5475567A | Method for hermetically sealing a single layer ceramic thick film electronic module | Electricity | 5 | Expired |
| US5895883A | Apparatus for dampening movement of passivation material in an electronic module | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.