Forming a pattern on a substrate
US5122439A · kind A · utility
23Cited by
9References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1989 |
| Grant date | Jun 16, 1992 |
| Priority date | — |
| Expiry date | Aug 28, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0353
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pattern is formed on a substrate by providing on the substrate a dielectric composition; defining a pattern in said dielectric; depositing metal and then micromachining the metal to provide the desired pattern on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.