Jae Man Park
56Patents
12h-index
123Co-inventors
87Inventor score
Filing activity: Jul 15, 1987 → Sep 5, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5300208A | Fabrication of printed circuit boards using conducting polymer | Electricity | 65 | Expired |
| US5232548A | Discrete fabrication of multi-layer thin film, wiring structures | Emerging Cross-Sectional Technologies | 56 | Expired |
| US4969979A | Direct electroplating of through holes | Electricity | 56 | Expired |
| US5283104A | Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates | Emerging Cross-Sectional Technologies | 53 | Expired |
| US5055342A | Fluorinated polymeric composition, fabrication thereof and use thereof | Emerging Cross-Sectional Technologies | 48 | Expired |
| US5280414A | Au-Sn transient liquid bonding in high performance laminates | Emerging Cross-Sectional Technologies | 25 | Expired |
| US5337475A | Process for producing ceramic circuit structures having conductive vias | Emerging Cross-Sectional Technologies | 25 | Expired |
| US5122439A | Forming a pattern on a substrate | Electricity | 23 | Expired |
| US4869930A | Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization | Electricity | 22 | Expired |
| US4781970A | Strengthening a ceramic by post sinter coating with a compressive surface layer | Emerging Cross-Sectional Technologies | 19 | Expired |
| US5173392A | Forming a pattern on a substrate | Electricity | 14 | Expired |
| US5421507A | Au-Sn transient liquid bonding in high performance laminates | Emerging Cross-Sectional Technologies | 13 | Expired |
| US7107730B2 | PSSC complex girder | Fixed Constructions | 12 | Expired |
| US6318038A | Apparatus for retensing pre-stress structure | Emerging Cross-Sectional Technologies | 8 | Expired |
| US4868253A | .beta.-diketone-polymer reaction product | Electricity | 7 | Expired |
| US5507872A | Contact sensor-based microdispensing tool | Emerging Cross-Sectional Technologies | 5 | Expired |
| US8941973B2 | Multilayer ceramic electronic component and method of manufacturing the same | Emerging Cross-Sectional Technologies | 5 | Active |
| US8867190B2 | Multilayer ceramic electronic component having an average surface roughness to provide adhesion strength between a dielectric layer and inner electrode and fabrication method thereof | Electricity | 5 | Active |
| US5340451A | Process for producing a metal organic polymer combination | Electricity | 4 | Expired |
| US9202629B2 | Multilayer ceramic electronic component | Electricity | 2 | Active |
| US10635421B2 | Electronic device, compiling method and computer-readable recording medium | Physics | 2 | Active |
| US9844142B2 | Radiant heat circuit board and method for manufacturing the same | Electricity | 2 | Active |
| US11117202B2 | High-feed cutting insert and cutting tool equipped with same | Performing Operations; Transporting | 2 | Active |
| US11117201B2 | Single-sided high feed cutting insert and cutting tool equipped with same | Performing Operations; Transporting | 2 | Active |
| US9468096B2 | Epoxy resin composition, and printed circuit board using same | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.