Lead frame having polymer coated surface portions
US5122858A · kind A · utility
58Cited by
21References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 1990 |
| Grant date | Jun 16, 1992 |
| Priority date | — |
| Expiry date | Sep 10, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composite leadframe for electronic packages is provided. A polymer layer coats a portion of the leadframe. The polymer layer increases the adhesive bond between the leadframe and a molding resin. Water vapor does not accumulate under the leads and die attach paddle minimizing the popcorn effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.