Method of achieving selective inhibition and control of adhesion in thick-film conductors
US5122929A · kind A · utility
10Cited by
6References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 17, 1989 |
| Grant date | Jun 16, 1992 |
| Priority date | — |
| Expiry date | Jan 17, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/092
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technique for providing controlled adhesion of a portion of a printed conductor to a circuit board employs an inhibitor layer between the circuit board and the portion of the printed conductor where such controlled adhesion is desired. The inhibitor layer is formed using a mixture of finely divided alumina powder and a glass frit, which are both suspended in an organic screening agent. An electrical module connected between controllably adherent conductor portions is thereby able to move to relative mechanical stresses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.