Molding pot having configured bottom
US5123826A · kind A · utility
12Cited by
5References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 13, 1990 |
| Grant date | Jun 23, 1992 |
| Priority date | — |
| Expiry date | Feb 13, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S425/228
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding apparatus for encapsulating devices and having a molding pot wherein the pot has a configured bottom is provided. The configured bottom serves as a shearing force against encapsulating material pellets which are pressed into the configured bottom by a plunger. The shearing force increases the fluidizing action of the pellets thereby lowering the viscosity of the encapsulating material so it easily enters cavities provided in the molding assembly and completely fills the cavities and encapsulates the devices without damage to the devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.