Method of patterned metal reflow on interconnect substrates
US5124175A · kind A · utility
14Cited by
13References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 1990 |
| Grant date | Jun 23, 1992 |
| Priority date | — |
| Expiry date | Nov 15, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/173
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Solder reflow on an electrical interconnect substrate between a plurality of electrical contacts. The method includes coating the contacts with tin/lead solder, depositing a wetting metal between the contacts, and heating the substrate to at least the melting point of the solder so that the solder melts, reflows across the wetting metal and connects or links the contacts. The entire surface of a customizable copper/polyimide substrate can be personalized by solder links and TAB leads from surface-mounted integrated circuits can simultaneously be soldered to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.