Thin film forming method and system
US5126027A · kind A · utility
17Cited by
7References
22Claims
0Family size
Inventors
Key dates
| Filing date | Oct 12, 1990 |
| Grant date | Jun 30, 1992 |
| Priority date | — |
| Expiry date | Oct 12, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/56
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thin film forming method includes the steps of preheating a plurality of base plates placed at a first position, sequentially picking up the base plates one by one and positioning a picked-up base plate at a second position, heating the picked-up base plate at the second position so that a temperature of the picked-up base plate becomes approximately equal to a predetermined temperature, moving the picked-up base plate from the second position to a third position, and growing a thin film on a surface of the picked-up base plate at the third position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.