Hideo Kudo
47Patents
16h-index
66Co-inventors
84Inventor score
Filing activity: Dec 29, 1986 → Jul 23, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5942445A | Method of manufacturing semiconductor wafers | Electricity | 97 | Expired |
| US5317778A | Automatic cleaning apparatus for wafers | Emerging Cross-Sectional Technologies | 62 | Expired |
| US5800725A | Method of manufacturing semiconductor wafers | Electricity | 49 | Expired |
| US5679212A | Method for production of silicon wafer and apparatus therefor | Performing Operations; Transporting | 40 | Expired |
| US5081733A | Automatic cleaning apparatus for disks | Emerging Cross-Sectional Technologies | 33 | Expired |
| US5951374A | Method of polishing semiconductor wafers | Performing Operations; Transporting | 33 | Expired |
| US5656348A | Optical recording medium and its recording apparatus and reproducing apparatus | Emerging Cross-Sectional Technologies | 30 | Expired |
| US5503173A | Wafer cleaning tank | Emerging Cross-Sectional Technologies | 28 | Expired |
| US5117590A | Method of automatically chamfering a wafer and apparatus therefor | Performing Operations; Transporting | 28 | Expired |
| US5282289A | Scrubber apparatus for cleaning a thin disk work | Performing Operations; Transporting | 23 | Expired |
| US6402594B1 | Polishing method for wafer and holding plate | Performing Operations; Transporting | 22 | Expired |
| US5914053A | Apparatus and method for double-sided polishing semiconductor wafers | Performing Operations; Transporting | 22 | Expired |
| US5547515A | Method for handling or processing semiconductor wafers | Emerging Cross-Sectional Technologies | 22 | Expired |
| US5179547A | Phase change optical information recording medium including means for preventing movement of the recorded portion | Physics | 17 | Expired |
| US5126027A | Thin film forming method and system | Chemistry; Metallurgy | 17 | Expired |
| US5827779A | Method of manufacturing semiconductor mirror wafers | Chemistry; Metallurgy | 16 | Expired |
| US7017749B2 | Precision substrate storage container and retaining member therefor | Performing Operations; Transporting | 15 | Expired |
| US6110839A | Method of purifying alkaline solution and method of etching semiconductor wafers | Chemistry; Metallurgy | 15 | Expired |
| US6050880A | Surface grinding device and method of surface grinding a thin-plate workpiece | Performing Operations; Transporting | 15 | Expired |
| US5447890A | Method for production of wafer | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5821167A | Method of manufacturing semiconductor mirror wafers | Electricity | 14 | Expired |
| US5185730A | Method for reading data from optical disk | Physics | 13 | Expired |
| US5474644A | Method and apparatus for high-flatness etching of wafer | Electricity | 12 | Expired |
| US8318275B2 | Multi-color molding article, multicolor molding method and substrate storage container | Emerging Cross-Sectional Technologies | 10 | Active |
| US5555634A | Wafer holder | Electricity | 10 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.