Flame retardant, low dielectric constant microsphere filled laminate
US5126192A · kind A · utility
87Cited by
15References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 1990 |
| Grant date | Jun 30, 1992 |
| Priority date | — |
| Expiry date | Jan 26, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A flame retardant, low dielectric constant, controlled coefficient of thermal expansion, low cost prepreg material which includes randomly distributed silane coated hollow microspheres has been prepared by standard impregnation and lamination techniques. Laminates made of this prepreg can be drilled cleanly for through holes and can be used as a substrate for surface mounted devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.