Robert M. Japp
77Patents
16h-index
58Co-inventors
87Inventor score
Filing activity: Oct 10, 1986 → May 18, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5126192A | Flame retardant, low dielectric constant microsphere filled laminate | Emerging Cross-Sectional Technologies | 87 | Expired |
| US6214525A | Printed circuit board with circuitized cavity and methods of producing same | Emerging Cross-Sectional Technologies | 75 | Expired |
| US6329603A | Low CTE power and ground planes | Emerging Cross-Sectional Technologies | 73 | Expired |
| US5900675A | Organic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion rates | Electricity | 55 | Expired |
| US7508076B2 | Information handling system including a circuitized substrate having a dielectric layer without continuous fibers | Electricity | 53 | Expired |
| US6373717B1 | Electronic package with high density interconnect layer | Emerging Cross-Sectional Technologies | 53 | Expired |
| US6351030B2 | Electronic package utilizing protective coating | Electricity | 50 | Expired |
| US6613413B1 | Porous power and ground planes for reduced PCB delamination and better reliability | Emerging Cross-Sectional Technologies | 42 | Expired |
| US5888850A | Method for providing a protective coating and electronic package utilizing same | Electricity | 39 | Expired |
| US6207595A | Laminate and method of manufacture thereof | Emerging Cross-Sectional Technologies | 30 | Expired |
| US5784782A | Method for fabricating printed circuit boards with cavities | Emerging Cross-Sectional Technologies | 26 | Expired |
| US7687722B2 | Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same | Emerging Cross-Sectional Technologies | 24 | Active |
| US6722031B2 | Method for making printed circuit board having low coefficient of thermal expansion power/ground plane | Emerging Cross-Sectional Technologies | 24 | Expired |
| US6399896B1 | Circuit package having low modulus, conformal mounting pads | Electricity | 23 | Expired |
| US6176985A | Laminated electroplating rack and connection system for optimized plating | Electricity | 22 | Expired |
| US6066386A | Printed circuit board with cavity for circuitization | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6829823B2 | Method of making a multi-layered interconnect structure | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6459047B1 | Laminate circuit structure and method of fabricating | Emerging Cross-Sectional Technologies | 14 | Expired |
| US4714504A | Process of laminating a photosensitive layer of a substrate | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6073344A | Laser segmentation of plated through-hole sidewalls to form multiple conductors | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6426470B1 | Formation of multisegmented plated through holes | Emerging Cross-Sectional Technologies | 13 | Expired |
| US5863332A | Fluid jet impregnating and coating device with thickness control capability | Emerging Cross-Sectional Technologies | 12 | Expired |
| US7596863B2 | Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein | Emerging Cross-Sectional Technologies | 12 | Active |
| US5719090A | Technique for forming resin-imprenated fiberglass sheets with improved resistance to pinholing | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6944946B2 | Porous power and ground planes for reduced PCB delamination and better reliability | Emerging Cross-Sectional Technologies | 11 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.