Flexible automated bonding method and apparatus
US5127570A · kind A · utility
47Cited by
6References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 1990 |
| Grant date | Jul 7, 1992 |
| Priority date | — |
| Expiry date | Jun 28, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49133
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A flexible automated bonding apparatus electrically interconnects integrated circuit carriers, printed circuit boards, and other devices. A metallized interconnect pattern is deposited on the surface of the substrate. The metallized interconnects in the pattern span apertures created in the substrate using an excimer laser. Thus, the metallized interconnects can be electrically bonded through the apertures to elements lying underneath the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.