Paul E. Schroeder
4Patents
4h-index
8Co-inventors
39Inventor score
Filing activity: Jun 28, 1990 → Nov 18, 1994
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5127570A | Flexible automated bonding method and apparatus | Emerging Cross-Sectional Technologies | 47 | Expired |
| US5548372A | PCB tooling apparatus for forming patterns on both sides of a substrate | Emerging Cross-Sectional Technologies | 31 | Expired |
| US5403684A | PCB tooling apparatus and method for forming patterns in registration on both sides of a substrate | Emerging Cross-Sectional Technologies | 15 | Expired |
| US5283948A | Method of manufacturing interconnect bumps | Emerging Cross-Sectional Technologies | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.