Method of fabricating an electronic micro-component self-sealed under vacuum, notably diode or triode
US5127990A · kind A · utility
24Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 1989 |
| Grant date | Jul 7, 1992 |
| Priority date | — |
| Expiry date | Jul 7, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J31/127
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The disclosure concerns the making of microcomponents belonging to the family of vacuum tubes of the diode, triode and electroluminescent component type. The goal thereof is notably to resolve problems of fabrication under vacuum, and of precise anode-cathode spacing. This goal is achieved by constructing a microcomponent of the stacked structure type wherein the anode is made in the form of a metallic layer for sealing the cavity under vacuum containing the microcathode, and wherein at least one solid dielectric layer provides for the spacing between the anode and the microcathode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.