Method for polishing semiconductor wafer edges
US5128281A · kind A · utility
33Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 1991 |
| Grant date | Jul 7, 1992 |
| Priority date | — |
| Expiry date | Jun 5, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B9/065
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for polishing the edges of a plurality of semiconductor wafers rotates a stack of wafers against a polish one or more pads such that both the wafer edges and the sides of the edges are polished to a mirror finish. The polish pad has a series of grooves through which the wafer edges are passed to polish the sides of the wafer edges, or two pads are used, one with grooves and one without grooves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.