Lawrence D. Dyer
14Patents
11h-index
33Co-inventors
72Inventor score
Filing activity: May 19, 1975 → May 4, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5597767A | Separation of wafer into die with wafer-level processing | Emerging Cross-Sectional Technologies | 73 | Expired |
| US6063696A | Method of reducing wafer particles after partial saw using a superhard protective coating | Electricity | 34 | Expired |
| US4502459A | Control of internal diameter saw blade tension in situ | Performing Operations; Transporting | 34 | Expired |
| US5128281A | Method for polishing semiconductor wafer edges | Performing Operations; Transporting | 33 | Expired |
| US4498345A | Method for measuring saw blade flexure | Emerging Cross-Sectional Technologies | 31 | Expired |
| US4501258A | Kerf loss reduction in internal diameter sawing | Performing Operations; Transporting | 26 | Expired |
| US5595522A | Semiconductor wafer edge polishing system and method | Emerging Cross-Sectional Technologies | 19 | Expired |
| US5424224A | Method of surface protection of a semiconductor wafer during polishing | Emerging Cross-Sectional Technologies | 18 | Expired |
| US5289661A | Notch beveling on semiconductor wafer edges | Performing Operations; Transporting | 17 | Expired |
| US5274959A | Method for polishing semiconductor wafer edges | Performing Operations; Transporting | 12 | Expired |
| US5817569A | Method of reducing wafer particles after partial saw | Electricity | 12 | Expired |
| US5240557A | Semiconductor wafer stacking apparatus and method | Emerging Cross-Sectional Technologies | 11 | Expired |
| US4935064A | Iodine sterilization of deionized water in semiconductor processing | Chemistry; Metallurgy | 4 | Expired |
| US4002523A | Dislocation-free growth of silicon semiconductor crystals with <110> orientation | Chemistry; Metallurgy | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.