Flexible film semiconductor package
US5130783A · kind A · utility
85Cited by
3References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 4, 1991 |
| Grant date | Jul 14, 1992 |
| Priority date | — |
| Expiry date | Mar 4, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thin film package is formed using a lost cost TAB interconnection on a semiconductor device and sandwiching the device between thin films of plastic to form a sealed, thin, light weight package for the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.