Neil McLellan
78Patents
31h-index
59Co-inventors
91Inventor score
Filing activity: Oct 3, 1986 → Aug 5, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6229200A | Saw-singulated leadless plastic chip carrier | Electricity | 426 | Expired |
| US6498099B1 | Leadless plastic chip carrier with etch back pad singulation | Electricity | 410 | Expired |
| US7372151B1 | Ball grid array package and process for manufacturing same | Electricity | 404 | Expired |
| US6242281A | Saw-singulated leadless plastic chip carrier | Electricity | 338 | Expired |
| US6294100A | Exposed die leadless plastic chip carrier | Electricity | 302 | Expired |
| US6585905B1 | Leadless plastic chip carrier with partial etch die attach pad | Electricity | 163 | Expired |
| US6635957B2 | Leadless plastic chip carrier with etch back pad singulation and die attach pad array | Electricity | 138 | Expired |
| US6946324B1 | Process for fabricating a leadless plastic chip carrier | Electricity | 128 | Expired |
| US6987032B1 | Ball grid array package and process for manufacturing same | Electricity | 114 | Expired |
| US7247526B1 | Process for fabricating an integrated circuit package | Electricity | 98 | Expired |
| US6933594B2 | Leadless plastic chip carrier with etch back pad singulation | Electricity | 96 | Expired |
| US6940154B2 | Integrated circuit package and method of manufacturing the integrated circuit package | Electricity | 86 | Expired |
| US5130783A | Flexible film semiconductor package | Electricity | 85 | Expired |
| US7091581B1 | Integrated circuit package and process for fabricating the same | Electricity | 84 | Expired |
| US6995460B1 | Leadless plastic chip carrier with etch back pad singulation | Electricity | 80 | Expired |
| US6933176B1 | Ball grid array package and process for manufacturing same | Electricity | 80 | Expired |
| US6737755B1 | Ball grid array package with improved thermal characteristics | Electricity | 77 | Expired |
| US6989294B1 | Leadless plastic chip carrier with etch back pad singulation | Electricity | 75 | Expired |
| US7411289B1 | Integrated circuit package with partially exposed contact pads and process for fabricating the same | Electricity | 75 | Expired |
| US7358119B2 | Thin array plastic package without die attach pad and process for fabricating the same | Electricity | 65 | Expired |
| US7371610B1 | Process for fabricating an integrated circuit package with reduced mold warping | Electricity | 63 | Expired |
| US7315080B1 | Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader | Electricity | 62 | Expired |
| US6841859B1 | Premolded cavity IC package | Electricity | 61 | Expired |
| US6429048B1 | Metal foil laminated IC package | Electricity | 60 | Expired |
| US6984785B1 | Thermally enhanced cavity-down integrated circuit package | Electricity | 58 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.