Composition for preparing printed circuit through-holes for metallization
US5132038A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 1990 |
| Grant date | Jul 21, 1992 |
| Priority date | — |
| Expiry date | Apr 18, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are compositions for use in a process for preparing the surfaces of through-holes in printed circuit boards (especially multilayer printed circuit boards) preparatory to a treatment of the through-holes with an alkaline permanganate solution, the composition being in the form of a substantially homogeneous, substantially clear mixture comprised of a substantially water-immiscible organic material which acts upon the insulating substrate of the circuit board, water, an alkakli metal compound and a surfactant component. The composition is useful as a pretreatment prior to the use of an alkaline permanganate solution in a desmearing and/or etch-back process, a combined desmearing-conditioning process, or a conditioning process following a separate desmearing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.